IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Cycling Ramifications of Lead-Free Solder on the Electronic Assembly Repair Process

Author(s): A C Chaloupka ; P A Sandborn ; A Konoza
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2011
Volume: 1
Page Count: 11
Page(s): 964 - 974
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2122308
Regular:

The conversion from tin-lead to lead-free electronics has created concern amongst engineers about the reliability of electronic assemblies and the ramifications that reliability changes may have... View More

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