IEEE - Institute of Electrical and Electronics Engineers, Inc. - Light Weight High Performance Thermal Management With Advanced Heat Sinks and Extended Surfaces

Author(s): T. Icoz ; M. Arik
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2010
Volume: 33
Page Count: 6
Page(s): 161 - 166
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2009.2026736
Regular:

Thermal management is a critical and essential component of maintaining high efficiency and reliability of electronic components. Adequate cooling must be provided while meeting the weight and... View More

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