IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics

Author(s): Boping Wu ; Leung Tsang
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2010
Volume: 33
Page Count: 7
Page(s): 510 - 516
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/TADVP.2009.2026482
Regular:

This paper successfully extends the Foldy-Lax multiple scattering approach to model massively-coupled multiple vias in substrate of layered dielectrics between two horizontal power/ ground plates.... View More

Advertisement