IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

Author(s): Lau, J. ; Yi-Hsin Pao ; Larner, C. ; Govila, R. ; Twerefour, S. ; Gilbert, D. ; Erasmus, S. ; Dolot, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Orlando, FL, USA
Conference Date: 1 June 1993
Page(s): 39 - 53
ISBN (Paper): 0-7803-0794-1
DOI: 10.1109/ECTC.1993.346854
Regular:

The reliability of 0.4 mm pitch, 28 mm body size, 256-Pin Plastic Quad Flat Pack (QFP) no-clean and water-clean solder joints has been studied by temperature cycling and analytical analysis. The... View More

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