IEEE - Institute of Electrical and Electronics Engineers, Inc. - Attachment reliability evaluation and failure analysis of thin small outline packages (TSOPs)

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

Author(s): Noctor, D.M. ; Bader, F.E. ; Viera, A.P. ; Boysan, P. ; Golwalkar, S. ; Foehringer, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Orlando, FL, USA
Conference Date: 1 June 1993
Page(s): 54 - 61
ISBN (Paper): 0-7803-0794-1
DOI: 10.1109/ECTC.1993.346853
Regular:

This paper describes a series of studies to evaluate the long term surface mount attachment reliability of TSOPs using thermal cycling as an acceleration method. Visual inspections, pull strength,... View More

Advertisement