IEEE - Institute of Electrical and Electronics Engineers, Inc. - Automatic process control of wire bonding

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

Author(s): Pufall, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Orlando, FL, USA
Conference Date: 1 June 1993
Page(s): 159 - 162
ISBN (Paper): 0-7803-0794-1
DOI: 10.1109/ECTC.1993.346839
Regular:

For the real-time recording of essential bond parameters: bond-force; ultrasonic amplitude; bonding time; during the bonding process, sensors are applied to the bond arm. The methods (measuring... View More

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