IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effectors of high temperature reliability in epoxy encapsulated devices

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

Author(s): Gallo, A.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Orlando, FL, USA
Conference Date: 1 June 1993
Page(s): 356 - 366
ISBN (Paper): 0-7803-0794-1
DOI: 10.1109/ECTC.1993.346820
Regular:

Ball shear testing of devices encapsulated with a variety of molding compounds after aging at either 200/spl deg/C/dry or 158/spl deg/C/85% R.H. has shown comparable or faster failure rates for... View More

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