IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of three-dimensional architectures on interconnects in gigascale integration

Author(s): J.W. Joyner ; R. Venkatesan ; P. Zarkesh-Ha ; J.A. Davis ; J.D. Meindl
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2001
Volume: 9
Page Count: 7
Page(s): 922 - 928
ISSN (Paper): 1063-8210
ISSN (Online): 1557-9999
DOI: 10.1109/92.974905
Regular:

An interconnect distribution model for homogeneous, three-dimensional (3-D) architectures with variable separation of strata is presented. Three-dimensional architectures offer an opportunity to... View More

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