IEEE - Institute of Electrical and Electronics Engineers, Inc. - Forced convection boiling in a microchannel heat sink

Author(s): Linan Jiang ; Man Wong ; Yitshak Zohar
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2001
Volume: 10
Page Count: 8
Page(s): 80 - 87
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/84.911095
Regular:

Micromachining technology was utilized to fabricate a transparent microchannel heat-sink system by bonding glass to a silicon wafer. The micro heat sink consisted of a microchannel array, a... View More

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