IEEE - Institute of Electrical and Electronics Engineers, Inc. - A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Author(s): C.-L. Shih ; B.-K. Lai ; H. Kahn ; S.M. Phillips ; A.H. Heuer
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2001
Volume: 10
Page Count: 11
Page(s): 69 - 79
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/84.911094
Regular:

Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the... View More

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