IEEE - Institute of Electrical and Electronics Engineers, Inc. - Prediction of paddle shift via 3-D TSOP modeling

Author(s): F. Su ; Sheng-Jye Hwang ; Huei-Huang Lee ; Durn-Yuan Huang
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2000
Volume: 23
Page Count: 9
Page(s): 684 - 692
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.888854
Regular:

This study develops a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during... View More

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