IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analytic modeling, optimization, and realization of cooling devices in silicon technology

Author(s): C. Perret ; J. Boussey ; C. Schaeffer ; M. Coyaud
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2000
Volume: 23
Page Count: 8
Page(s): 665 - 672
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.888851
Regular:

A novel cooling device fully built in silicon technology is presented. The new concept developed in this work consists of micromachining the bottom side of the circuit wafer in order to embed heat... View More

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