IEEE - Institute of Electrical and Electronics Engineers, Inc. - Manufacturing and materials properties of Ti/Cu/Electroless Ni/solder bump on Si

Author(s): Kwang-Lung Lin ; Kun-Tzu Hsu
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2000
Volume: 23
Page Count: 4
Page(s): 657 - 660
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.888849
Regular:

This work attempted to fabricate the solder bump with the structure: Si/Ti/Cu/Electroless Ni/solder. The shear strength of the solder bump, with bump pad of 60 /spl mu/m in diameter, is... View More

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