IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging

Author(s): D.P.H. Hasselman ; K.Y. Donaldson ; F.D. Barlow ; A.A. Elshabini ; G.H. Schiroky ; J.P. Yaskoff ; R.L. Dietz
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2000
Volume: 23
Page Count: 5
Page(s): 633 - 637
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.888846
Regular:

The thermal resistance and its temperature dependence was measured for three industrial adhesives used for electronic packaging. Measurements were made by the laser-flash method from room... View More

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