IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection

Author(s): J. Lohan ; P. Tiilikka ; P. Rodgers ; C.-M. Fager ; J. Rantala
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2000
Volume: 23
Page Count: 9
Page(s): 578 - 586
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.868861
Regular:

The steady state thermal performance of an isolated SO-8 package is experimentally characterized on five thermal test printed circuit boards (PCBs) and the results compared against corresponding... View More

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