IEEE - Institute of Electrical and Electronics Engineers, Inc. - Foreword thermal investigations of ICs and systems (THERMINIC)

Author(s): B. Courtois ; C. Lasance
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2000
Volume: 23
Page Count: 2
Page(s): 546 - 547
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2000.868856
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