IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

Author(s): K. Pinardi ; Z. Lai ; D. Vogel ; Yi Lan Kang ; J. Liu ; S. Liu ; R. Haug ; M. Willander
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2000
Volume: 23
Page Count: 5
Page(s): 447 - 451
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.868843
Regular:

Flip chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip... View More

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