IEEE - Institute of Electrical and Electronics Engineers, Inc. - Flip chip underfill flow characteristics and prediction

Author(s): P. Fine ; B. Cobb ; L. Nguyen
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2000
Volume: 23
Page Count: 8
Page(s): 420 - 427
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.868839
Regular:

This paper presents recent results on underfill flow characterization. The flow properties of a number of commercial and experimental underfills were recorded and analyzed using quartz test chips... View More

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