IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced flip chip bonding techniques using transferred microsolder bumps

Author(s): N. Koshoubu ; S. Ishizawa ; H. Tsunetsugu ; H. Takahara
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2000
Volume: 23
Page Count: 6
Page(s): 399 - 404
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.846781
Regular:

For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which... View More

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