IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBTs

Author(s): M. Busani ; R. Menozzi ; M. Borgarino ; F. Fantini
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2000
Volume: 23
Page Count: 8
Page(s): 352 - 359
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.846774
Regular:

In this work we show a method for the thermal dynamic modeling of packaged HBTs. The method employs a calibration step featuring pulsed measurements at different temperatures, and is based upon a... View More

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