IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging

Author(s): Xiang Dai ; M.V. Brillhart ; M. Roesch ; P.S. Ho
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2000
Volume: 23
Page Count: 11
Page(s): 117 - 127
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.833050
Regular:

The flip chip-on-organic-substrate packaging technology utilizes a particulate reinforced epoxy as the underfill (UF) to adhere the chip to the package or board, Although the use of... View More

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