IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers

Author(s): K. Take ; Y. Furukawa ; S. Ushioda
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2000
Volume: 23
Page Count: 6
Page(s): 80 - 85
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.833045
Regular:

A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the... View More

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