IEEE - Institute of Electrical and Electronics Engineers, Inc. - Laser ablation of anisotropic conductive adhesive

Author(s): L.A. Harvilchuck ; P.I. Presunka ; J.H. Constable
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2000
Volume: 23
Page Count: 7
Page(s): 277 - 283
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.895072
Regular:

A laser ablation process has been developed and optimized for the rework of anisotropic conducting adhesive bonds. Ablative photodecomposition of the adhesive matrix and simultaneous removal of... View More

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