IEEE - Institute of Electrical and Electronics Engineers, Inc. - Taguchi design of experiment for wafer bumping by stencil printing

Author(s): J.H. Lau ; C. Chang
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2000
Volume: 23
Page Count: 7
Page(s): 219 - 225
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.873251
Regular:

Taguchi experiments are designed and carried out with five critical factors that influence the solder bumping of a 200 mm (8 in) wafer by the stencil printing method. These factors are: paste... View More

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