IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film

Author(s): Myung Jin Yim ; Young-Doo Jeon ; Kyung-Wook Paik
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2000
Volume: 23
Page Count: 6
Page(s): 171 - 176
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.873244
Regular:

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances, resulting in a high performance and cost-competitive... View More

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