IEEE - Institute of Electrical and Electronics Engineers, Inc. - Manufacturing ultra fine line PBGA substrates in a PWB factory

Author(s): J.W. Wilson ; R.D. Sebesta ; A. D'Aloisio
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2000
Volume: 23
Page Count: 5
Page(s): 132 - 136
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.846936
Regular:

The industry trends for PBGA substrates are smaller and smaller features to support more input/output (I/O) in less space. Packaging technologies such as fine pitch wire bonding and flip chip... View More

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