IEEE - Institute of Electrical and Electronics Engineers, Inc. - The influence of solder fillet geometry on the occurrence of corona discharge during operation between 400 and 900 V in partial vacuum

Author(s): M. Materassi ; B.D. Dunn ; L. Capineri
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2000
Volume: 23
Page Count: 12
Page(s): 104 - 115
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.846933
Regular:

A number of experiments have been made to study the effect that different solder joint designs have on the voltage needed to initiate the onset of corona discharge under low ambient pressures.... View More

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