IEEE - Institute of Electrical and Electronics Engineers, Inc. - Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules

Author(s): R.L. Shook ; J.P. Goodelle
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2000
Volume: 23
Page Count: 6
Page(s): 81 - 86
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.846930
Regular:

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the... View More

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