IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies

Author(s): J.R. Ganasan
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Volume: 23
Page Count: 4
Page(s): 28 - 31
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.827523
Regular:

The move to highly populated printed wire assemblies and smaller sized end user products has led to the more common use of flex rigid substrates or the use of flexible substrates. The material... View More

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