IEEE - Institute of Electrical and Electronics Engineers, Inc. - Failure analysis of solder bumped flip chip on low-cost substrates

Author(s): J.H. Lau ; C. Chang ; S.-W.R. Lee
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Volume: 23
Page Count: 9
Page(s): 19 - 27
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.827522
Regular:

Failure analyses of 63/37 Sn/Pb solder bumped flip chip assemblies with underfill encapsulant are presented in this study, Emphasis is placed on solder flowed-out, nonuniform underfill and voids,... View More

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