IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

Author(s): R. Haug ; R. Behner ; C.-P. Czaya ; Hongquan Jiang ; S.F. Kotthaus ; R. Schuetz ; C.P.O. Treutler
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Volume: 23
Page Count: 7
Page(s): 12 - 18
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.827521
Regular:

Small modules on the basis of laminate substrates are often used as a functional subunit in electronic applications. Currently most of them are made by chip and wire technique as one kind of bare... View More

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