IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cost analysis: solder bumped flip chip versus wire bonding

Author(s): J.H. Lau
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Volume: 23
Page Count: 8
Page(s): 4 - 11
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.827520
Regular:

The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is studied. The effects of IC chip yields, gold and solder materials, and major equipment of these... View More

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