IEEE - Institute of Electrical and Electronics Engineers, Inc. - Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

Author(s): N.M. Poon ; C.M.L. Wu ; J.K.L. Lai ; Y.C. Chan
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2000
Volume: 23
Page Count: 7
Page(s): 708 - 714
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.883762
Regular:

In this study, two lead-free solder alloys, namely 50 tin-50 bismuth (Sn-Bi) and 96.5 tin-3.5 silver (Sn-Ag), were studied for their use in surface mount solder joints. They have been considered... View More

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