IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and evaluation criterion for thermocompression flip-chip bonding

Author(s): T.S. McLaren ; Y.-C. Lee
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2000
Volume: 23
Page Count: 9
Page(s): 652 - 660
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.883755
Regular:

A single joint finite element model (FEM) using a newly developed configuration independent evaluation criterion has been created, and experimentally verified, to provide more accurate predictions... View More

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