IEEE - Institute of Electrical and Electronics Engineers, Inc. - MEMS post-packaging by localized heating and bonding

Author(s): L. Lin
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2000
Volume: 23
Page Count: 9
Page(s): 608 - 616
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.883749
Regular:

This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for... View More

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