IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influences of molding conditions on die-pad behavior in IC encapsulation process analyzed by Hall element method

Author(s): M. Sato ; H. Yokoi
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 8
Page(s): 574 - 581
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861576
Regular:

It is important to analyze the dynamic die-pad behavior during the integrated circuit (IC) encapsulation process in order to reduce such defects caused by the die-pad movement as exposure of the... View More

Advertisement