IEEE - Institute of Electrical and Electronics Engineers, Inc. - Underfill adhesion to BCB (Cyclotene/sup TM/) bumping and redistribution dielectrics

Author(s): P. Garrou ; D. Scheck ; Jang-Hi Im ; J. Hetzner ; G. Meyers ; D. Hawn ; Jiali Wu ; M.B. Vincent ; C.P. Wong
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 6
Page(s): 568 - 573
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861575
Regular:

The adhesion of several commercial underfills (Dexter Hysol FP4511, FP4527, and CNB775-34) to BCB (CYCLOTENE 4022, 4024) has been studied through die shear testing and subsequent failure analysis.... View More

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