IEEE - Institute of Electrical and Electronics Engineers, Inc. - Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading-Part II: Material properties and package geometry factors

Author(s): T. Saitoh ; H. Matsuyama ; M. Toya
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 7
Page(s): 554 - 560
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861573
Regular:

For Part I see ibid., vol.21, pp.422-27 (Nov. 1998). A comprehensive study is made to evaluate the effects of material properties and package geometry factors on the delamination growth along the... View More

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