IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of measurement system for die-pad behavior in IC encapsulation process using Hall elements

Author(s): M. Sato ; H. Yokoi
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 8
Page(s): 546 - 553
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861572
Regular:

This paper describes a new method of measuring the die-pad behavior in the integrated circuit (IC) encapsulation process using Hall elements and a permanent magnet. The method enables us to... View More

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