IEEE - Institute of Electrical and Electronics Engineers, Inc. - A compact three-dimensional packaging technique using super-fine-pitch coaxial connector arrays for on-board satellite equipment

Author(s): F. Ishitsuka ; N. Iwasaki ; T. Ohira ; Y. Suzuki ; Y. Ando
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 8
Page(s): 530 - 537
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861570
Regular:

A compact three-dimensional (3-D) inter-module microwave packaging technique has been developed that drastically reduces the volume of on-board satellite equipment of phased-array beam control... View More

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