IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process induced warpage in multitiled alumina substrates for large area MCM-D processing

Author(s): A.X.H. Dang ; I.C. Ume ; S.K. Bhattacharya
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 11
Page(s): 436 - 446
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861558
Regular:

Electronics industries are responding to consumer demands in low-cost and high performance products for the 21st century, In order to find a low-cost solution for the future multichip module (MCM)... View More

Advertisement