IEEE - Institute of Electrical and Electronics Engineers, Inc. - Impact of solder pad size on solder joint reliability in flip chip PBGA packages

Author(s): L.L. Mercado ; V. Sarihan ; Y. Guo ; A. Mawer
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 6
Page(s): 415 - 420
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861555
Regular:

A variety of parameters impact package reliability. One set of parameters that does not get much attention is the variations in package design that are assembly and vendor related. This study... View More

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