IEEE - Institute of Electrical and Electronics Engineers, Inc. - Broadband modeling and measurement of the signal behavior in S/390 MCM packages

Author(s): F.M. Ktata ; U. Arz ; H. Grabinski
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2000
Volume: 23
Page Count: 7
Page(s): 375 - 381
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.861550
Regular:

In this work, we investigate the electrical performance of critical signal paths in IBM's S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators like e.g. SPICE.... View More

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