IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder joints

Author(s): W. Huang ; O.A. Palusinski ; D.L. Dietrich
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2000
Volume: 23
Page Count: 8
Page(s): 277 - 284
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.846646
Regular:

A statistical reliability analysis on thermal fatigue lifetime of surface mount solder joints, considering randomness of Cu-Sn intermetallic compound (IMC) layer thickness, is presented. Based on... View More

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