IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of three-dimensional memory die stack packages using polymer insulated sidewall technique

Author(s): Hyoung Soo Ko ; J.S. Kim ; Hyun Gook Yoon ; Se Young Jang ; Sung Dong Cho ; Kyung Wook Paik
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2000
Volume: 23
Page Count: 5
Page(s): 252 - 256
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.846643
Regular:

A newly designed three dimensional (3-D) memory die stack package has been established, and the prototype of the 3-D package using mechanical dies has been successfully demonstrated. Fabrication... View More

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