IEEE - Institute of Electrical and Electronics Engineers, Inc. - MicroSMD-a wafer level chip scale package

Author(s): N. Kelkar ; R. Mathew ; H. Takiar ; L. Nguyen
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2000
Volume: 23
Page Count: 6
Page(s): 227 - 232
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.846639
Regular:

This paper outlines National Semiconductor's concept of wafer level chip scale package-also known as microSMD. This new packaging technology has been demonstrated using an 8 I/O package with 0.5... View More

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