IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability of thick Al wire bonds in IGBT modules for traction motor drives

Author(s): J. Onuki ; M. Koizumi ; M. Suwa
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2000
Volume: 23
Page Count: 5
Page(s): 108 - 112
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.826768
Regular:

Reliability enhancement of thick Al wire bonds during thermal fatigue test has been investigated from a metallurgical viewpoint. Al wire bonds degrade with the increase of crack length during... View More

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