IEEE - Institute of Electrical and Electronics Engineers, Inc. - High performance chip to substrate interconnects utilizing embedded structure

Author(s): T.A. Juhola ; B. Kerzar ; M. Mokhtari ; L.F. Eastman
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2000
Volume: 23
Page Count: 9
Page(s): 27 - 35
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.826759
Regular:

Integrated circuit (IC) feature sizes reaching nanoscale range, it is important to bridge the gap between modules and chips with design rules similar to that of IC fabrication technologies. A... View More

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