IEEE - Institute of Electrical and Electronics Engineers, Inc. - On enhancing eutectic solder joint reliability using a second-reflow-process approach

Author(s): Kuo-Ning Chiang ; Yung-Te Lin ; Hsien-Chie Cheng
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2000
Volume: 23
Page Count: 6
Page(s): 9 - 14
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.826755
Regular:

A three-dimensional (3-D) solder liquid formation model is developed for predicting the geometry, the restoring force and the reliability of solder joints in an area array of interconnects [e.g.,... View More

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