IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new lateral field emission device using chemical-mechanical polishing

Author(s): Choon-Sup Lee ; Jae-Duk Lee ; Chul-Hi Han
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2000
Volume: 21
Page Count: 3
Page(s): 479 - 481
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/55.870607
Regular:

A polysilicon lateral field emission device using chemical-mechanical polishing (CMP) is proposed and experimental results on the first prototype are reported. In this method, dry oxidation... View More

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